Tuesday, January 20, 2015

This is Google’s new Project Ara modular phone: Spiral 2

This is Google’s new Project Ara modular phone: Spiral 2

 Jan 14, 2015
Google has revealed its newest Project Ara prototype, Spiral 2, the latest iteration of the block-based modular smartphone it expects to change how users interact with software and hardware. Spiral 2 builds on the MDK version 0.20 which Google released earlier this month, and was shown today for the first time at Google's second Project Ara developer conference. Now with eleven different prototype modules, each of which will act as a reference design for third-party developers hoping to get onboard with Ara themselves, Spiral 2 supports hot-swapping those modules as well as making 3G calls.
The hardware for Spiral 2 is done, Head of Project Ara Paul Eremenko said, though the firmware itself is not. "Firmware is hard," he joked, inviting any firmware experts attending the developer event to contact him regarding a job.
Spiral 2 prototype scattered_264
The changes in Spiral 2 has seen the electro-permanent magnets which hold the modules in place moved, now into the endoskeleton frame, leaving more room in the modules themselves. There are two application processors, from Marvell and NVIDIA, while Rockchip is working on a dedicated chip itself.
Ara Spiral 2 specs
Google has also confirmed the exact Spiral 2 reference specifications. There'll be a 1280 x 720 display, light & proximity sensors, a 5-megapixel camera, WiFi and Bluetooth, 3G modem with a Band 2 antenna, separate Band 5 antenna, battery, and speaker module, as well as the choice of a Marvell PXA1928 or NVIDIA Tegra K1 processor block. A final block will have the USB charger port.
Spiral 2 endo_166
Spiral 2 also shifts the cellular antennas from the modems themselves, which will lead to more flexibility when 4G LTE modules arrive.
What there won't be is 3D printing of modules, at least initially. According to Eremenko, getting 3D printing technologies to a point where they were realistic for production volumes and at the quality that consumers would expect was simply too ambitious for the current timescale.
Spiral 2 modules_201
Instead, ATAP turned to a second proposal it had been working on simultaneously. Using dye-sublimation, modules made of injection-molded polycarbonate plastic will be able to be customized at high resolution and in full color.
Meanwhile, Google also previewed some of the changes the ATAP team expects for Spiral 3. Biggest of those will probably be contactless data connections between the different modules, replacing the spring-loaded pins with inductive systems that stop the scratching the Spiral 2 experiences, as well as making them more flexible.
Spiral 2 prototype_090
Spiral 3 will also have new magnets, and the antennas will be shifted into the endo - the backbone of the phone - rather than putting them into the modules.
Spiral 2 prototype (AP PCB and shield exposed)_281
Power consumption will be lowered, bigger batteries supported, and new battery technologies introduced. That has seen Google engage with battery manufacturers that might not normally see their wares in current smartphones - usually because they don't meet the recharge cycle requirements - and offering optional higher-density packs with shorter lifespans for those consumers willing to make that compromise.
We'll have more from the Project Ara developer event over the course of the day.

Data Centre Transformation Master Class


https://www.youtube.com/playlist?list=PL7FDDE74B36E78F06

Data Centre Transformation Master Class

  • Data Centre Transformation Master Class 1: Cloud Saving
  • Data Centre Transformation Master Class 2: Cloud Computing
  • Data Centre Transformation Master Class 3: Cloud Architecture
  • Data Centre Transformation Master Class 4: Considerations 
  • Data Centre Transformation Master Class 5: A Roadmap
  • Data Centre Transformation Master Class 6: Virtualisation
  • Data Centre Transformation Master Class 7: Portfolio 
  • Data Centre Transformation Master Class 8: Customer Examples


https://www.youtube.com/playlist?list=PL7FDDE74B36E78F06

Wednesday, January 14, 2015

Alcatel's OneTouch Pixi 3

Alcatel's OneTouch Pixi 3 is like a box of chocolates: You never know what you're gonna get


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LAS VEGAS -- I don't even know how to start describing the Alcatel Pixi 3 I saw at CES 2015, because there's no single phone to see. There are 24.
Alcatel is starting with four base configurations and letting carrier partners choose the data connection (4G LTE or 3G) and the operating system (Android, Windows Phone, Firefox).
So, the Pixi 3 that shows up in your country could be anything from a 3.5-inch Firefox OS handset with a 1GH dual-core processor and 5-megapixel camera to a 5-inch Android 5.0 Lollipop phone with an 8-megapixel camera and quad-core chip.If this isn't confusing enough, the carriers also get to choose among seven eye-melting fluorescent shades, including black (but not white). This is also a future Pixi 3 owner's chance to splash out a bit; they'll be able to acquire a different colored back cover to pop on.
With so much up in the air, there is just one constant in the Pixi 3, and that's its status as an inexpensive entry-level phone. Rounded edges and a plastic design remain rock-steady across all the device permutations.
Although there's no pricing structure yet (that will depend on the set of specs a carrier picks), you can bet it'll be on the more budget end of the scale, the market segment that Alcatel really dives into.

구글 조립형 스마트폰 '아라폰' 공개 임박.. 업계 반응은

구글 조립형 스마트폰 '아라폰' 공개 임박.. 업계 반응은
서울경제 | 입력시간 : 2015-01-09 17:12:11
구글의 야심작인 50달러(5만5,000원) 조립형 스마트폰 '아라폰' 공개가 임박하면서 업계의 이목이 집중되고 있다.

9일 관련 업계에 따르면 구글의 아라 개발팀인 '프로젝트 아라'는 홈페이지를 통해 1월 14일과 21일 미국과 싱가포르에서 개발자 회의를 개최한다고 밝혔다.

업계에서는 이 자리에서 아라의 실체가 드러날 것으로 전망하고 있다.

아라는 휴대전화의 카메라, 배터리 등 각 기능을 블록(모듈)으로 만들어 사용자가 취향대로 선택해 조립하는 스마트폰이다.

업계에서 아라를 주목하는 이유는 성공할 경우 구글의 영향력이 하드웨어까지 확장돼 모바일 시장이 '구글 천하'가 될 수 있다는 우려 때문이다. 제조사들이 구글의 안드로이드 운영체제(OS)에 예속돼 있는 상황에서 아라 마저 성공하면 구글에 하드웨어 플랫폼까지 예속돼 단순 부품 업체로 전락할 수 있다는 것이다.

구글의 저가형 조립폰 등장에 대한 시장의 반응은 엇갈린다.

우선 저가를 무기로 성장 중인 중국 업체들에 위협적 요인이 될 수 있다는 지적이다. 아울러 과거 조립형 컴퓨터에서 볼 수 있듯 사용자가 고가 부품을 구입해 초고사양의 스마트폰을 제작할 경우 삼성전자와 애플도 견제를 받을 것 수 있어 시장에 상당한 영향력을 발휘할 수 있다는 분석이다.

반면 집 안에 두는 컴퓨터와 달리 디자인과 브랜드가 각광 받는 휴대전화 시장을 고려하면 한계가 있다는 지적도 나온다. 인도나 아프리카 등 일부 저가 시장에서 인기를 끄는 데 그칠 것이라는 전망도 나오고 있다.

이현호기자 hhlee@sed.co.kr